Semiconductors Parts begin by M5 Page11

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Semiconductors Parts begin by M5, Total parts = 998

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Part number: M5M5V416BTP-70HI
Organization: 256K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin
Temperature: -40 ~ 85°C

Part number: M5M5V416BTP-70HW
Organization: 256K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin
Temperature: -20 ~ 85°C

Part number: M5M5V416BTP-85H
Organization: 256K x 16
Access Time (ns): 85
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin
Temperature: 0 ~ 70°C

Part number: M5M5V416BTP-85HI
Organization: 256K x 16
Access Time (ns): 85
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin
Temperature: -40 ~ 85°C

Part number: M5M5V416BTP-85HW
Organization: 256K x 16
Access Time (ns): 85
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin
Temperature: -20 ~ 85°C

Part number: M5M5V416BUG-70HI
Organization: 256K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.6
Package Outline: CSP
Package Size: 48-ball
Temperature: -40 ~ 85°C

Part number: M5M5V416CWG-70HI
Organization: 256K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.0
Package Outline: CSP
Package Size: 48-ball
Temperature: -40 ~ 85°C

Part number: M5M5V5636GP-16
Organization: 512K x 36
Frequency(MHz): 167
VDD(V): 3.3
VDDQ(V): 3.3/2.5
Function: Pipeline ReadDouble Late Write
Package: 100TQFP
Package Size: -
Bump Pich: -

Part number: M5M5W816TP-55HI
Organization: 512K x 16
Access Time (ns): 55
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin400mil
Temperature: -40 ~ 85°C

Part number: M5M5W816TP-70HI
Organization: 512K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin400mil
Temperature: -40 ~ 85°C

Part number: M5M5W816TP-85HI
Organization: 512K x 16
Access Time (ns): 85
Vcc(V): 2.7 to 3.6
Package Outline: TSOP-II
Package Size: 44-pin400mil
Temperature: -40 ~ 85°C

Part number: M5M5W816WG-55HI
Organization: 512K x 16
Access Time (ns): 55
Vcc(V): 2.7 to 3.6
Package Outline: CSP
Package Size: 48-ball7.5x8.5mm2
Temperature: -40 ~ 85°C

Part number: M5M5W816WG-70HI
Organization: 512K x 16
Access Time (ns): 70
Vcc(V): 2.7 to 3.6
Package Outline: CSP
Package Size: 48-ball7.5x8.5mm2
Temperature: -40 ~ 85°C

Part number: M5M5W816WG-85HI
Organization: 512K x 16
Access Time (ns): 85
Vcc(V): 2.7 to 3.6
Package Outline: CSP
Package Size: 48-ball7.5x8.5mm2
Temperature: -40 ~ 85°C

Part number: M5M5Y416CWG-70HI
Organization: 256K x 16
Access Time (ns): 70
Vcc(V): 1.65 to 2.3
Package Outline: CSP
Package Size: 48-ball
Temperature: -40 ~ 85°C

Part number: M5M5Y416CWG-85HI
Organization: 256K x 16
Access Time (ns): 85
Vcc(V): 1.65 to 2.3
Package Outline: CSP
Package Size: 48-ball
Temperature: -40 ~ 85°C

Part number: M5M5Y5636TG-20
Organization: 512K x 36
Frequency(MHz): 200
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y5636TG-22
Organization: 512K x 36
Frequency(MHz): 225
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y5636TG-25
Organization: 512K x 36
Frequency(MHz): 250
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y5672TG-20
Organization: 256K x 72
Frequency(MHz): 200
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y5672TG-22
Organization: 256K x 72
Frequency(MHz): 225
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y5672TG-25
Organization: 256K x 72
Frequency(MHz): 250
VDD(V): 1.8
VDDQ(V): 1.8
Function: Pipeline ReadDouble Late Write
Package: 209 FBGA
Package Size: 14mm x 22mm
Bump Pich: 1.0mm

Part number: M5M5Y816WG-70HI
Organization: 512K x 16
Access Time (ns): 70
Vcc(V): 1.65 to 2.3
Package Outline: CSP
Package Size: 48-ball7.5x8.5mm2
Temperature: -40 ~ 85°C

Part number: M5M5Y816WG-85HI
Organization: 512K x 16
Access Time (ns): 85
Vcc(V): 1.65 to 2.3
Package Outline: CSP
Package Size: 48-ball7.5x8.5mm2
Temperature: -40 ~ 85°C

Part number: M5N317L
Description: Variable Positive Output 3-Terminal Regulator
Package: 3-pin Transistor

Part number: M5N324P
Description: Quad Single Power Supply Operational Amplifiers
Package: 14-pin DIP

Part number: M5N324PP
Description: Quad Single Power Supply Operational Amplifiers
Package: 14-pin MINI FLAT

Part number: M5N358P
Description: Dual Single Power Supply Operational Amplifiers
Package: 8-pin SOP

Part number: M5R4558P
Description: Dual Low-Noise Operational Amplifiers (Dual Power Supply Type)
Package: 8-pin SOP

Part number: M5T082P
Description: Dual J-FET Input Operational Amplifiers
Package: 8-pin SOP

Part number: M5T494FP
Description: Switching Regulator Control
Package: 16-pin SOP

Part number: M5T494GP
Description: Switching Regulator Control
Package: 16-pin SOP

Part number: M5T494P
Description: Switching Regulator Control
Package: 16-pin DIP